CHANGELOG

The release naming convention follows Semantic Versioning.

v2.1.1

GDSFactory-maintained release based on Luxtelligence v2.1.0, with the additions and fixes below.

New

• Add lnoi400.mzm_with_pads with GSG pads and three-conductor transmission-line tapers.
• Expose individual signal and ground ports on CPW pads and MZMs while preserving legacy MZM ports.

Bug fixes

• Fix ring-resonator slab generation so shared cached components are not modified.
• Align chip-frame and PHIX die edge-coupler placement to the physical chip edge on layer 6/1. The default straight tip extends 5 µm outside and at least 5 µm inside the chip.
• Document the approximately 30 µm straight section for polishing and the insertion-loss tradeoff for unpolished tips.
• Correct Manhattan port-orientation checks at angle wraparound boundaries.

v2.0

New

• Technology definition for ltoi300
• Basic Component definitions: edge couplers, mmis, ring cavities, phase and amplitude modulators for O-band and C-band
• Added first compact models for ltoi300
• Added one more circuit placement example notebook for the ltoi300 technology
• Expand README with KLayout lyp and DRC instructions

v1.3.0

New

• Added high-speed versions of mzm_unbalanced and eo_phase_shifter #107
• Making project compatible with gdsfactoryplus #105
• Support 2x2 MMI in MZM cell

Bug fixes

• Fix layerspec import
• MZM caching bugfix

v1.2.0

New

• Balanced directional coupler building block
• Add wavelength dependence to phase shifter model
• Add thermo-optical phase shifter cell

v0.1.1

Bug fixes

• Fix typo for the heater layer in LayerStack
• Fix optics layer names (ridge, slab)
• Use center parameter in chip_frame

v0.1.0

New

• Technology definition for lnoi400
• Basic Component definitions: bends, edge coupler, mmis, uniform CPWs, phase and amplitude modulators
• Circuit models based on sax
• Example notebooks for:
  • Layout with routing to the chip facets
  • Circuit simulation